GE Global Research Demonstrates Feasibility Of Thin Film Encapsulation For Flexible OLED Displays Under Cooperative Program With USDC

Results Achieved will Enhance Potential for Commercial Success in Flexible Displays [The following is a release from GE Global Research and the U.S. Display Consortium]

May 21, 2008

The U.S. Display Consortium (USDC), a public/private partnership chartered with developing the flexible electronics and displays industry supply chain, today announced the completion of a cooperative R&D program with GE Global Research—with the potential to accelerate commercialization of flexible organic light emitting diodes (OLED) displays. GE has demonstrated an ultra high barrier (UHB) thin-film encapsulation process on a wide variety of OLED structures through a batchmode, plasma-enhanced chemical vapor deposition (PECVD) process. This encapsulation method solves a critical need in the display industry for high-performance, hermetic packaging and enables lightweight, flexible rugged flat panel devices to be manufactured by a low cost, high throughput process such as roll-to-roll manufacturing (R2R). The encapsulation studies were performed on OLEDs from several leading companies working in the emerging flexible and printed electronics industry. Goals of the program included, demonstrating flexibility and achieving luminescence-current-voltage (LIV) characteristics, as well as shelf and operational life performance comparable to glass and metal encapsulated OLEDs. “Encapsulating OLEDs presented a significantly different challenge from our previous success in producing barrier-coated plastic substrates,” commented Dr. Ahmet Gün Erlat, materials scientist at GE Global Research. “The USDC-funded program provided GE with the opportunity to further develop key technologies and applications that can dramatically impact the flexible electronics infrastructure.” “GE demonstrated this new technology in partnership with USDC member companies developing OLED displays and lighting,” remarked Dr. Mark Hartney, USDC’s chief technology officer. “They have demonstrated equivalent performance to glass substrate barriers, as well as the capability of the barrier to withstand extreme flexing conditions. This will greatly enhance the industry’s knowledge base for encapsulating OLEDs on flexible substrates.” “GE Global Research is to be congratulated on their successful completion of this competitively bid R&D award from the USDC. GE's groundbreaking research in emerging technologies, such as large area and flexible electronics, is exactly the kind of private sector activity we want to encourage to enhance our region's economic base and establish a local foothold in new, cutting-edge technology for the future,” stated Rep. Kirsten Gillibrand

Read More: