Furutech FI-28 Series Power Connectors

New for 2009! FI-28(R) and FI-28M(R) Power Connectors MSRP: $98/each Male or IEC • Shipping 2nd Week of January '09 CES Venetian Tower 30-201 [The following is a release from Furutech]

December 22, 2008

Furutech Co., Ltd., manufacturer of analog and digital audio and video cable and accessories, debuts another sophisticated and thoroughly engineered AC connectors in the world, the FI-28(R) and FI-28M(R). Features α (Alpha) pure-copper rhodium-plated conductors Floating Field Damper System* eliminates magnetic interference Nylon/fiberglass body incorporating carbon particles that absorb vibration and resonance Specified for cable diameters from 6mm to 17.5mm Dimensions: FI-28(R) • 39.6mm diameter x 76.2mm overall length FI-28M(R) • 39.6mm diameter x 71.6mm overall length Metal cable clamp improves grip and reduces mechanically and electrically induced distortion Rating: FI-28(R) • 10A 250V /15A 125V AC / FI-28M(R) • 15A 125V AC * We’ve renamed the patented Earth/Ground Jumper System to better describe the circuit’s engineering and effects. US Patent No. 6,669,491. The Furutech Floating Field Damper System The Floating Field Damper completely solves the biggest problem you never realized you had by star grounding the metal parts in which floating magnetic fields are created by current flow through the connector. A precisely engineered, sprung metal bridge ties the various parts together and shunts the potential to ground, significantly reducing distortion for ultra clean and stable power transfer. Specially Engineered Pressure Plate and Cable Clamp Furutech engineers have calculated that the increase in contact area is precisely 17.142%! Our specially designed secure metal cable clamp relieves strain on wire bundles of all sizes. Furutech Pure Transmission Philosophy Meticulous build quality is a large part of the engineering equation. Furutech Pure Transmission technology turns a macro lens on every element of power and signal transfer applying optimized engineering solutions to well-known problems such as contact resistance, EMI and RFI rejection, grounding, and using the best materials and processes available.

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