2011 CEDIA Future Technology Pavilion To Simulate Home Environment Of Tomorrow

July 1, 2011

The Custom Electronic Design & Installation Association (CEDIA) has announced details surrounding the 2011 Future Technology Pavilion that will appear on the CEDIA EXPO tradeshow floor. The Future Technology Pavilion first appeared on the CEDIA EXPO tradeshow floor in 2010. This year’s pavilion will simulate a future home environment with individual rooms showcasing technologies for the kitchen, living room, bedroom, bathroom, home office and garage. “The Future Technology Pavilion is designed to be a preview of how emerging trends will be integrated into home technology systems in the coming months and years,” said Dave Pedigo, Senior Director of Technology for CEDIA. “CEDIA EXPO attendees are getting a sneak peek at how they will be able to capitalize on these cutting-edge technologies in the near future.” Highlights of this year’s pavilion include a video wall, smart appliances, wireless power for cooking and charging, and fully integrated home health and wellness products. The systems on display in the Future Technology Pavilion will represent a model of how new and emerging technologies will be integrated into the homes of tomorrow. Some products are just hitting the market, and others will be available within a few years. The Future Technology Pavilion will be open during tradeshow hours, Thursday September 8 and Friday September 9 from 9:00 a.m. to 6:00 p.m. and Saturday September 10 from 9:00 a.m. to 5:00 p.m. A list of participating companies is available here. CEDIA will release additional details regarding the Future Technology Pavilion as the show approaches. The CEDIA EXPO virtual registration brochure offers more information on the Future Technology Pavilion as well as other events planned for the show. Registration for CEDIA EXPO 2011 is open at www.cedia.org/expo. Early-bird registration discounts are available until July 15. For more information, visit www.cedia.org/expo or call 800.669.5329/317.328.4336.

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